IEEE DySPAN 2018 Workshop: 5G and Spectrum Sharing (5G Spectrum)
October 22nd, 2018
With recent development in standardization and industry, 5G is now ready to make a big debut. The 5G wireless provides the market with mobile broadband, massive connectivity, and reliable/low latency services. This will enable immersive virtual reality in moving objects such as fast-moving cars and drones. The variety of such use case covers autonomous driving, smart city and smart factory (factory of the future, industry 4.0), which will reshape wireless industry from the bottom. Many AI applications are now under experiment, broadening the 5G connectivity even further.
On the other hand, the scarcity of good spectrum will increase its value rapidly as we move forward 5G. The wide bandwidth of mmWave may not support some applications requiring massive connectivity and low latency, due to its intrinsic feature. This urges us to rethink spectrum sharing more seriously in 5G and beyond, in particular for the frequencies under 6GHz.
This workshop revisits “spectrum sharing,” the most classical issue in cellular radio, but now from 5G and beyond-5G perspectives. The effort will be from the physical layer upto applications. We invite potential authors to the workshop with their original results and recent ideas, in the following areas but not limited to:
- Spectrum sharing for low latency service in moving objects (drones and cars)
- Dynamic spectrum access in mmWave systems
- Opportunity detection and machine learning
- AI-enabled algorithms and computation for interference avoidance/pain-sharing
- 5G vertical applications and dynamic spectrum access
- Smart licensing in 5G and beyond-5G
- Regulatory bottlenecks, economic and business aspects related to the use of 5G
Paper Submission Format
Authors will need to follow the IEEE conference paper style. Details about the format can be found here: http://www.ieee.org/conferences_events/conferences/publishing/templates.html
The maximum page limit for the workshop papers is 5 pages, including references and appendices.
To submit your paper, visit the following link: https://edas.info/N24273
Papers submitted IEEE DySPAN 2018 will follow a double-blind review process. This means that authors of the submitted papers will need to remove all information revealing their identity (this includes author names, affiliations, references to citations that imply the work was previously done by the author(s), and references to sponsoring agencies).
• Paper submission deadline: August 31, 2018
• Notification of acceptance: September 15, 2018
• Camera-ready deadline: September 22, 2018
• Workshop: October 22, 2018
Workshop Organizer and Program Chairs
Seong-Lyun Kim, Yonsei University, Korea, firstname.lastname@example.org
Riku Jäntti, Aalto University, Finland, email@example.com
Du Ho Kang, Ericsson, Sweden, firstname.lastname@example.org